Surface Mount Assembly Machine

MYDATA - MY 9

With the placement machine MY 9 of MYDATA, the electric components are placed on a printed circuit board. In a following soldering process, the components are mounted onto the board.
The following components are supplied to the machine:

• blister tapes on reels (for the majority of SMD components)
• trays with cavities (for larger ICs)
• plastic tubes (for larger components)

The following MYDATA film presents the surface mount process.

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