Vapour Phase Soldering

For this soldering process, the SLC 300 of IBL-Löttechnik GmbH is used.
A chemically inert liquid is heated to boiling temperature. A saturated, chemically inert vapour phase forms. The temperature of the vapour is identical to the boiling point of the liquid. After the immersion of an electronic assembly, vapour condenses on the surface of the assembly until it has reached the temperature of the vapour. The solder paste, which has a melting point below the temperature of the vapour, is then already in liquid state. After cooling the circuit board, the components are securely attached on the board.